|
 |
GENERAL INFORMATION
- EPOXY COMPOUNDS
|
EP 30
Gel, EP 50 Gel, EP 70 Gel, EP 90 Gel |
Soft
epoxy gels with a range of hardness from 30
to 90 Shore A.
|
|
EP 65 |
Moderate
viscosity, flexible epoxy compound, low
hardness and high elongation, excellent
adhesion properties |
|
EP 71
EP 71/304 IP |
Low
viscosity, mix ratio 1:1 to 1:1.5, clear,
flexible compound.
Same A
side as above, different hardener with
different properties |
|
EP 80 |
Low
viscosity, clear, unfilled, semi flexible
epoxy compound for general purposes,
injection, impregnation etc. |
|
EP 80 FR |
A filled
version of EP 80. MeetsUL-94-V0 standard |
|
EP 109 |
Equal
ratio, medium viscosity, low exotherm, low
shrinkage, high thermal shock resistance and
good fuel and oil resistance
|
|
EP 118 |
Equal
ratio, low viscosity, general purpose,
non-abrasives epoxy potting and casting
compound
(Compare
to Emerson Coming™ 3180-M, 3M™ 232, Haysol™
4412)* |
|
EP 118 P /
EP 118 T |
Equal
ratio, epoxy paste for coating, adhesive and
sealant. |
|
EP 136 |
General
purpose, moderate viscosity, potting /
casting compound, high thermal conductivity,
Conforms to MIL-I-16923 |
|
EP 136-40 |
General
purpose, law viscosity, potting / casting
compound. Conforms to MIL-I-16923 |
|
EP 140 |
High
thermal conductivity compound, moderate
viscosity, high chemical resistant, potting
/ casting compound |
|
EP 140 FR |
High
thermal conductivity compound, moderate
viscosity, high chemical resistant, potting
/ casting compound,
UL-94-V-0 approved. |
|
EP 140 MB |
High
chemical resistance, very strong adhesive
strength concrete / concrete, metals,
ceramics etc. |
|
EP 142
|
Low
viscosity, thermal resistant epoxy potting,
casting, encapsulating compound.
|
|
EP 145 |
Mid
viscosity, highly filled, high thermal
conductivity with low thermal expansion |
|
EP 147 |
Very high
thermal conductivity compound, moderate
viscosity, high chemicals resistant, potting,
casting, encapsulating compound |
|
EP 169 |
Low
viscosity, clear, unfilled, general purposes,
casting epoxy compound. |
|
EP 169 FR |
Low
viscosity, general purposes, casting epoxy
compound. UL-94-V-0 approved |
|
EP 174 |
Epoxy casting
compound with adjustable flexibility for
casting, coating and sealant. |
|
EP 333 |
Self
extinguishing, low viscosity potting, casting,
encapsulating compound, UL 94 V-0 approved |
|
EP 333 PW |
Self-extinguishing, low viscosity potting,
casting, encapsulating compound, UL 94 V-0
approved. |
|
EP 333 T |
Self
extinguishing, coating compound,
Flammability
standard UL 94 V-0. |
|
EP 333 HV |
Self
extinguishing, moderate viscosity potting,
casting, encapsulating compound, flame class UL
94 V-0. |
|
EP 501 |
General
purpose, clear casting epoxy compound
|
|
EP 501 P
|
General
purpose, casting, coating, sealant adhesive
epoxy compound |
|
EP 502 |
Low
viscosity, general purpose, clear potting,
casting epoxy compound |
|
EP 502 MD |
Equal ratio,
low viscosity, potting, encapsulating,
semi-flexible compound with high thermal shock
resistance. |
|
EP 502 BK |
Low
viscosity, clear or colored, unfilled, potting
epoxy compound. |
|
EP 515 |
Low
viscosity, semi-rigid, multi-purpose epoxy
compound |
|
EP 980, EP
981, EP 982 |
Semi-flexible
epoxy compound with superior thermal shock
resistance, potting / encapsulating compound
|
|
GENERAL INFORMATION - ADHESIVES
|
|
General Purpose, 1:1,
clear adhesive |
|
|
General Purpose, 1:1,
filled adhesive, semi rigid |
|
|
General Purpose, fast
curing, 5 to 7 minutes set time |
|
EP GP 20 |
General Purpose, fast
curing, 20 minutes set time |
|
EP GP 30 |
General Purpose, equal
ratio, 30 minutes set and casting |
|
EP 160 DV |
Equal ratio, Un filled,
flexible epoxy adhesive/ sealant |
|
EP 170 DV |
Two Components, filled,
flexible epoxy adhesive/ sealant |
|
EP 216 DV |
Two components, high shock
and thermal resistivity adhesive |
|
EP 438/12 DV |
Two components,
semi-rigid, high chemicals resistance adhesive |
|
EP 438/12 DV/EPC 690 (XP) |
Two components, rigid epoxy, high chemicals
resistance adhesive |
|
EP 710 AN |
Heat Cure, Two components,
High thermal and thermal shock resistivity adhesive |
|
EP 900 DV |
Two components, flexible
adhesive for metals, ceramics, rigid and semi rigid plastics. |
|
|
Similar to EP 900 DV but
low viscosity. |
|
EP 950 DV /
EP 955 DV |
One component, heat cure
epoxy adhesive for electronics and high tech use, wires, electronics
connections, PC board etc. |
|
|
Two component epoxy
adhesive, very high thermal conductivity and high chemical resistance. |
|
|
Two components, 1:1,
flexible filled epoxy adhesive, Very useful in electronic and high tech
industries, as well as a general purpose. High thermal shock resistance. |
|
EP 1990 DV |
Two components, 1:1,
flexible filled epoxy adhesive, Very useful in electronic and high tech
industries, as well as a general purpose. High thermal shock resistance. |
|
|
Epoxy cement putty. |
|
|
Aluminum filled epoxy for
general purpose, maintenance and D.I.Y use. |
|
Epoxy Steel Putty |
Steel filled epoxy for
general purpose, maintenance and D.I.Y use. |
|
|
Two components, rigid
urethane adhesive, high adhesion strength to metals, wood, and many plastics
|
|
|
Two components urethane
adhesive for wood, plastics, urethane plats etc. |
|
|
Two components urethane
adhesive, 1:1 (by volume) perform excellent adherence to wood, plastics, glass
etc. |
|
|
Two components, flexible
urethane adhesive, 1:1 (by volume), perform excellent adherence to wood,
plastics, glass etc |
GENERAL INFORMATION - URETHANE COMPOUNDS
|
U - 22 |
Two
components, low viscosity, fast cure, flexible, high tear and high elongation
urethane compound. |
|
U - 45 |
Was designated for asphalt roads cracks (Hebrew).
|
|
U - 105 |
Urethane encapsulating compound, very flexible with high hydrophilic properties. |
|
U - 108 |
Low
viscosity, fast cure potting and encapsulating urethane compound. Semi-flexible. |
|
|
Two
components, encapsulating urethane compound, flexible, high tear strength high
adhesion strength to a varied materials. |
|
U - 115 |
Two
components, very low viscosity, fast cure casting urethane. |
|
U - 116 |
Two
components, very low viscosity, fast cure casting urethane. Higher flexibility
than U 115. |
|
U -
146-0 |
Two
components, very low viscosity, fast cure casting urethane. |
|
U - 205
|
Low
viscosity, flexible encapsulating compound. Flame class - UL 94 V-0, approved. |
|
U - 232
|
General purpose, electrical potting and casting compound. Standard flame class
- UL 94 V-0, approved. |
|
U -
232 MY /
MY-S |
General purpose, semi-flexible electrical potting and casting compound.
Standard flame class - UL 94 V-0. |
|
U - 233 |
General purpose, low viscosity, electrical potting and casting, semi-flexible
compound. |
|
U- 238
|
General purpose, low viscosity, semi-rigid potting, urethane compound. |
|
U -
246-0 |
Low
viscosity, very fast cure, very high abrasion resistant, high chemicals
resistance, casting, urethane compound. |
|
U -
248-0 |
Low
viscosity, very fast cure casting, urethane compound especially for molds and
models. |
|
U - 300 |
Low
viscosity, two components, fast creaming and curing polyurethane compound.
|
GENERAL INFORMATION -
RTV SILICONE COMPOUNDS
|
RTV
111 |
Two components,
general-purpose RTV silicone sealant / encapsulant, low viscosity.
(Condensation).
(Compare to GE™ RTV-11, Dow Corning™
RTV-3110)* |
|
RTV
113 |
Two components,
general-purpose RTV silicone sealant / encapsulant, medium viscosity, high
durometer. (Condensation)
(Compare to GE™ RTV-31, Dow Corning™
RTV-3120)* |
|
RTV
116 |
Two components,
general-purpose RTV silicone sealant / encapsulant, high viscosity, high
durometer. (Condensation)
(Compare to GE™ RTV-60)* |
|
RTV
146 |
Two components, low
density, pourable RTV silicone, syntactic foam. (Condensation) |
|
RTV
185 |
Two components, high
tear, mold making RTV silicone. (Condensation) |
|
RTV
186 |
Two components, high
tear, mold making RTV silicone. (Condensation) |
|
RTV
187/188/189 |
Two components RTV
Silicone, high tear, very soft for printing pads. (Condensation). |
|
RTV
227 |
Two components RTV
silicone, potting/casting compound, low viscosity, 1:1 mix ratio, flame class -
94 V - 0. (Vinyl groups)
(Compare to GE™ RTV-627, Dow Corning™
Silgard 170)* |
|
RTV
261 |
Two components, RTV
silicone compound, clear, low viscosity. (Vinyl groups)
(Compare to GE™ RTV-615 Dow Corning™ Silgard
184)* |
|
RTV
262 |
Two components, RTV
silicone compound, translucent, high tear, mid viscosity (Vinyl groups) |
|
RTV
263 |
Two components, RTV
silicone compound, translucent, high tear, mid viscosity (Vinyl groups) |
|
RTV
266 |
Two components, RTV
silicone compound, mix ratio 1: 1, clear, low viscosity (Vinyl groups) |
|
RTV
268 |
Two components, RTV
silicone compound, mix ratio 1: 1, clear, low viscosity, very soft (Taki) (Vinyl
groups)
(Compare to GE™ RTV-602 Dow Corning™ Silgard
184)* |
|
RTV 269 |
Two components, RTV
silicone compound, mix ratio 1: 1, clear, low viscosity, very soft (Taki) (Vinyl
groups) |
|
RTV
295 |
Two components, RTV
silicone encapsulant, high thermal conductivity, deep section cure (Vinyl
groups) |
|
RTV
502 |
Two components, RTV
silicone high tear, mold making (Vinyl groups) |
|
|
|
|
|
|
